- All sections
- C - Chemistry; metallurgy
- C09K - Materials for applications not otherwise provided for; applications of materials not otherwise provided for
- C09K 5/14 - Solid materials, e.g. powdery or granular
Patent holdings for IPC class C09K 5/14
Total number of patents in this class: 1479
10-year publication summary
|
132
|
138
|
180
|
173
|
168
|
144
|
173
|
175
|
164
|
63
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Shin-Etsu Chemical Co., Ltd. | 5132 |
62 |
| Denka Company Limited | 2189 |
52 |
| Toshiba Materials Co., Ltd. | 600 |
37 |
| FUJIFILM Corporation | 27102 |
34 |
| Toshiba Corporation | 12017 |
32 |
| Sekisui Polymatech Co., Ltd. | 192 |
30 |
| Fuji Polymer Industries Co., Ltd. | 107 |
28 |
| Global Graphene Group, Inc. | 246 |
25 |
| 3m Innovative Properties Company | 18406 |
22 |
| Sekisui Chemical Co., Ltd. | 3159 |
22 |
| Dexerials Corporation | 1826 |
18 |
| Laird Technologies, Inc. | 385 |
17 |
| Samsung Electronics Co., Ltd. | 131630 |
16 |
| Henkel AG & Co. KGaA | 10129 |
16 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
15 |
| Sumitomo Electric Industries, Ltd. | 14131 |
14 |
| Kaneka Corporation | 4445 |
14 |
| Nitto Denko Corporation | 7879 |
13 |
| Resonac Corporation | 2233 |
13 |
| DIC Corporation | 3597 |
12 |
| Other owners | 987 |